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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
ICF-324-S-I-TR Samtec Inc. ICF-324-S-I-TR 6.3827
RFQ
ECAD 8024 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-324-S-I-TR 275 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
0475960233 Molex 0475960233 -
RFQ
ECAD 6070 0.00000000 Molex 47596 Tray Obsolete - Surface Mount LGA Open Frame 047596 Solder download ROHS3 Compliant 1 (Unlimited) EAR99 8538.90.8180 240 Thermoplastic UL94 V-0 0.036" (0.91mm) Gold 30.0µin (0.76µm) - - 1155 (40 x 40) Copper Alloy 0.036" (0.91mm) - - -
ICF-624-STL-O-TR Samtec Inc. ICF-624-STL-O-TR 5.9161
RFQ
ECAD 4066 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-624-STL-O-TR 275 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
612-83-632-41-001101 Preci-Dip 612-83-632-41-001101 3.0978
RFQ
ECAD 8897 0.00000000 Preci-Dip 612 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.291" (7.39mm) 10mOhm
16-3513-11 Aries Electronics 16-3513-11 3.0098
RFQ
ECAD 1764 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
523-13-169-17-101003 Mill-Max Manufacturing Corp. 523-13-169-17-101003 -
RFQ
ECAD 5079 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 169 (17 x 17) - 0.100" (2.54mm) - 0.510" (12.95mm) -
100-PRS17048-12 Aries Electronics 100-PRS17048-12 92.7000
RFQ
ECAD 7335 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 100-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
110-83-640-41-001151 Preci-Dip 110-83-640-41-001151 2.6704
RFQ
ECAD 7620 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame, No Center Bar 110-83 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
104-13-648-41-770000 Mill-Max Manufacturing Corp. 104-13-648-41-770000 18.9163
RFQ
ECAD 2908 0.00000000 Mill-Max Manufacturing Corp. 104 Tube Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 104-13 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Thermoplastic - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) -
523-93-100-13-061002 Mill-Max Manufacturing Corp. 523-93-100-13-061002 -
RFQ
ECAD 6500 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 100 (13 x 13) - 0.100" (2.54mm) - 0.510" (12.95mm) -
1-1437537-7 TE Connectivity AMP Connectors 1-1437537-7 -
RFQ
ECAD 9701 0.00000000 TE Connectivity AMP Connectors 800 - Obsolete - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 1437537 Solder download RoHS non-compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 60 - - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - - 8 (2 x 4) Copper Alloy 0.100" (2.54mm) - - -
04-7400-10 Aries Electronics 04-7400-10 5.1429
RFQ
ECAD 3370 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 04-7400 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 60 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 4 (1 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
523-93-240-17-061002 Mill-Max Manufacturing Corp. 523-93-240-17-061002 -
RFQ
ECAD 6570 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 240 (17 x 17) - 0.100" (2.54mm) - 0.510" (12.95mm) -
146-43-308-41-013000 Mill-Max Manufacturing Corp. 146-43-308-41-013000 2.1600
RFQ
ECAD 350 0.00000000 Mill-Max Manufacturing Corp. 146 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 146-43 Press-Fit - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 50 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) -
515-93-144-12-000003 Mill-Max Manufacturing Corp. 515-93-144-12-000003 -
RFQ
ECAD 4504 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 144 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
ICA-640-SGT-L Samtec Inc. ICA-640-SGT-L 9.0946
RFQ
ECAD 8898 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-640-SGT-L 11 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
614-87-044-08-031112 Preci-Dip 614-87-044-08-031112 4.9743
RFQ
ECAD 1604 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 26 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 44 (8 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
522-13-144-13-041002 Mill-Max Manufacturing Corp. 522-13-144-13-041002 -
RFQ
ECAD 5920 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 144 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
510-13-088-13-062001 Mill-Max Manufacturing Corp. 510-13-088-13-062001 33.2255
RFQ
ECAD 8221 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 88 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
510-83-068-11-061101 Preci-Dip 510-83-068-11-061101 3.9510
RFQ
ECAD 9989 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 68 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
18-354000-10 Aries Electronics 18-354000-10 -
RFQ
ECAD 8885 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 18-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 18 Beryllium Copper 0.050" (1.27mm) Brass - -
10-7775-10 Aries Electronics 10-7775-10 9.1628
RFQ
ECAD 4919 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 10-7775 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
116-83-610-41-011101 Preci-Dip 116-83-610-41-011101 1.4705
RFQ
ECAD 1769 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
APA-314-G-A Samtec Inc. APA-314-G-A 8.2900
RFQ
ECAD 6580 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-314 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
317-93-118-41-005000 Mill-Max Manufacturing Corp. 317-93-118-41-005000 14.4210
RFQ
ECAD 4068 0.00000000 Mill-Max Manufacturing Corp. 317 Bulk Active -55°C ~ 125°C Through Hole SIP - 317-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 18 (1 x 18) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) 10mOhm
522-41-132-14-071001 Mill-Max Manufacturing Corp. 522-41-132-14-071001 -
RFQ
ECAD 4620 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-41 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 132 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
550-80-100-15-001101 Preci-Dip 550-80-100-15-001101 10.6576
RFQ
ECAD 9618 0.00000000 Preci-Dip 550 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 550-80 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 100 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.164" (4.16mm) 10mOhm
26-8500-310C Aries Electronics 26-8500-310C 15.0703
RFQ
ECAD 7734 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 26-8500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
14-0503-21 Aries Electronics 14-0503-21 9.9263
RFQ
ECAD 6505 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 14-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (1 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
523-13-036-06-000002 Mill-Max Manufacturing Corp. 523-13-036-06-000002 -
RFQ
ECAD 2422 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 36 (6 x 6) - 0.100" (2.54mm) - 0.510" (12.95mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse