SIC
close

az3133-04f

I. Product Overview and Core Technical Features
Amazing Microelectronic Corp.'s AZ3133-04F (https://www.sic-components.com/product/product?product_id=16615458) is a Transient Voltage Suppressing Device (TVS) specifically designed for high-speed data lines, offering protection against transient overvoltage threats such as Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), and Lightning surges, while also supporting Latch-Up Protection. As a core product in Amazing's high-speed protection series, its technical features focus on high-reliability protection and low-loss signal compatibility, making it suitable for high-frequency communication scenarios like Ethernet, USB, and HDMI.
1. Wide-Range Transient Protection Capability
The AZ3133-04F adheres to international EMC standards, delivering the following protection performance:
ESD Protection: Compliant with IEC 61000-4-2, it provides ±30kV contact/air discharge capability, far exceeding the industrial Level 4 standard (±8kV contact, ±15kV air) to withstand extreme electrostatic environments.
Surge and Pulse Protection:
Supports IEC 61000-4-4 EFT pulses (80A, 5/50ns);
Meets IEC 61000-4-5 lightning surge standards, withstanding 50A (8/20μs) and 1kV (10/700μs) surges;
Compatible with Cable Discharge Event (CDE) protection, covering transient risks in industrial and consumer electronics scenarios.
2. Low-Loss and High-Speed Signal Adaptation
Low Operating Voltage and Capacitance:
With a 3.3V operating voltage, it adapts to mainstream high-speed interface levels. Its line-to-line capacitance is as low as 12pF (typical), and line-to-ground capacitance is 20pF (typical), minimizing signal attenuation and distortion in Gigabit-level transmissions (e.g., 10/100/1000M Ethernet) to ensure data integrity.
Fast Response and Dynamic Clamping:
Utilizing solid-state silicon avalanche technology and active circuit triggering design, it achieves nanosecond-level response times. The clamping voltage dynamically optimizes with pulse current—for example, line-to-ground clamping voltage ≤15V at 50A pulse current (8/20μs)—significantly reducing voltage stress on protected components and preventing damage.
3. Compact Package and User-Friendly Design
DFN2525P10E Package:
Measuring only 2.5x2.5mm with a 10-pin design, pins 1-3 and 8-10 correspond to two differential line pairs (Line1/Line2), while pins 4-7 are no-connect (NC). The center tab connects directly to ground, facilitating short grounding paths in PCB design to reduce parasitic inductance and enhance high-frequency protection efficiency.
Green Certification:
Compliant with Pb-free, RoHS, and halogen-free standards, meeting global environmental regulations for eco-sensitive consumer and industrial devices.

II. Typical Application Scenarios and Circuit Design
1. Network Communication
Ethernet Interface Protection:
The AZ3133-04F can be directly connected in parallel between differential signal lines (e.g., Tx+/Tx-, Rx+/Rx-) and ground in 10M/100M/1000M Ethernet connectors to suppress ESD and surges from cables. In typical circuits, pairing with a 0.1μF decoupling capacitor further enhances anti-interference capabilities (as shown in Figure 1).
Application Case: Protecting high-speed differential backplane buses in switches to prevent transient overvoltage damage to PHY chips or switch chips during port plugging/unplugging.
Industrial Communication Equipment:
Provides differential input protection for industrial interfaces like RS-485 and CAN buses, meeting strict EMC requirements of IEC 61000 standards for smart manufacturing and building automation.
2. Computers and Consumer Electronics
Motherboard High-Speed Interfaces:
Used for high-speed data lines such as USB 3.0/4.0, HDMI 2.0, and Thunderbolt to protect against electrostatic shocks during external device connections, preventing transient overvoltage failures in motherboard chips (e.g., USB controllers).
Mobile Devices and IoT:
Protects charging ports (e.g., USB-C) and data lines of smartphones and tablets from daily ESD events; provides surge protection for high-speed communication links in IoT sensor networks (e.g., Wi-Fi, Bluetooth), enhancing device stability in complex electromagnetic environments.
3. Industrial and Instrumentation
Automation Control Equipment:
Protects high-speed pulse input/output (I/O) ports in industrial robots and programmable logic controllers (PLCs) from induced lightning or transient interference caused by motor start/stop.
Test and Measurement Instruments:
Safeguards differential input channels of oscilloscopes and spectrum analyzers from accidental overvoltage damage to precision front-end circuits.

III. PCB Design Guidelines and Performance Optimization
To maximize the protective efficiency of AZ3133-04F, PCB layout should follow these principles:
1. Shorten Signal Paths
Place the device close to input connectors or ports to minimize transient signal transmission distance on the PCB, reducing parasitic inductance and coupling risks.
Avoid inserting other active components or long traces between the protection device and the protected circuit.
2. Efficient Grounding Design
Center Tab Grounding: Connect the center tab to a large-area ground plane via a short, straight path (recommended path length <10mm) to reduce ground impedance and ensure rapid transient current discharge.
Multilayer Board Use: Prioritize 4+ layer PCBs to leverage inner-layer ground planes for low-impedance current loops, enhancing high-frequency protection performance.
3. Sensitive Signal Isolation
Avoid routing critical signals (e.g., clock lines, power lines) near board edges or ESD-prone areas (e.g., connectors) to minimize crosstalk and transient coupling.
Use independent grounding partitions to prevent noise interference from mixed digital and analog grounds.

IV. Specification Parameters and Ordering Information
Parameter Category Key Indicators
Absolute Maximum Ratings - Peak Pulse Current (8/20μs): 50A
- Lead Soldering Temperature: 260°C (10s)
- Operating Temperature: -55~+125°C
Electrical Characteristics - Reverse Stand-Off Voltage: 3.3V
- Channel Leakage Current: ≤1μA
- Reverse Breakdown Voltage: ≥3.9V
- Clamping Voltage: ≤11V at 5A, ≤15V at 50A
Package and Dimensions DFN2525P10E (2.5x2.5x0.6mm), 10 pins (including center ground tab)
Ordering Information - Model: AZ3133-04F.R7G (green eco-friendly version)
- Packaging: 7-inch tape-and-reel, 3,000 units/reel, MOQ 12,000 units/box

V. Conclusion: An Ideal Choice for High-Speed Protection Scenarios
The AZ3133-04F, with its high-integration design, wide-range transient protection, and low-loss signal compatibility, serves as a core device for high-speed data line protection. Its broad applications in network communications, computers, and industrial control highlight Amazing Microelectronic’s technological leadership in EMC protection. As 5G and IoT technologies demand higher reliability for high-speed interfaces, the AZ3133-04F will continue to provide critical support for electronic system stability and safety.

Amazing Microelectronic Corp.'s AZ3133-04F (https://www.sic-components.com/product/product?product_id=16615458)
AZ3133-04F Datasheet: https://datasheet.sic-components.com/AZ3133-04F.pdf

banner

Hot Products

View More
  • BF494_D74Z onsemi

    BF494_D74Z onsemi

  • KSC2786OBU onsemi

    KSC2786OBU onsemi

  • AT-32063-TR2G Broadcom Limited

    AT-32063-TR2G Broadcom Limited

  • HFA3127BZ Renesas Electronics America Inc

    HFA3127BZ Renesas Electronics America Inc

  • BFG10W/X,115 NXP USA Inc.

    BFG10W/X,115 NXP USA Inc.

  • 2SC2228E-AE onsemi

    2SC2228E-AE onsemi

  • NE68119-T1 CEL

    NE68119-T1 CEL

  • HFA3128R Renesas Electronics America Inc

    HFA3128R Renesas Electronics America Inc

  • BFR949TE6327 Infineon Technologies

    BFR949TE6327 Infineon Technologies

  • BFT25,215 NXP USA Inc.

    BFT25,215 NXP USA Inc.

  • 2N5583 Solid State Inc.

    2N5583 Solid State Inc.

Related Blogs

  • 2025 / 07 / 19

    Broadcom BCM5714CKPB: Featrues,Applications,Datasheet And Advantages

    When it comes to reliable, high-performance network connectivity in enterprise and industrial systems, the Broadcom BCM5714CKPB stands as a standout solution. This dual-port Gigabit Ethernet controller, developed by Broadcom—a leader in semiconductor innovation—combines robust features, versatile co...

    Broadcom BCM5714CKPB: Featrues,Applications,Datasheet And Advantages
  • 2025 / 07 / 15

    MC7447AHX1000NB: Technical Analysis and Applications of a High-Performance PowerPC Architecture Proc

    In the field of embedded computing and network systems, the performance, energy efficiency, and compatibility of processors are often crucial to the success of a design. The MC7447AHX1000NB launched by NXP (formerly Freescale), as an important member of the MPC7447A series, has become an ideal choic...

    MC7447AHX1000NB: Technical Analysis and Applications of a High-Performance PowerPC Architecture Proc
  • 2025 / 07 / 14

    Nexperia Unveils New 1200V/20A SiC Schottky Diodes to Empower Efficient Industrial Power Innovations

    Nexperia recently announced the addition of two new 1200V, 20A silicon carbide (SiC) Schottky diodes—PSC20120J and PSC20120L—to its power electronics portfolio, further expanding its product landscape in high-performance semiconductors. Specifically designed to address the increasingly stringent dem...

    Nexperia Unveils New 1200V/20A SiC Schottky Diodes to Empower Efficient Industrial Power Innovations
  • 2025 / 07 / 09

    CD4007: A Comprehensive Analysis of a Multifunctional CMOS Integrated Circuit

    In the field of modern electronic technology, CMOS (Complementary Metal-Oxide-Semiconductor) integrated circuits have become core components in digital and analog circuit design due to their low power consumption, high integration, and excellent compatibility. As a classic CMOS device, the CD4007 oc...

    CD4007: A Comprehensive Analysis of a Multifunctional CMOS Integrated Circuit
  • 2025 / 07 / 07

    Understanding IC 7408: A Fundamental Component in Digital Logic Design

    In the vast and intricate realm of digital electronics, integrated circuits (ICs) serve as the building blocks that enable the creation of complex and powerful systems. Among these, the IC 7408 holds a special place as a fundamental component in digital logic design. This article aims to provide a c...

    Understanding IC 7408: A Fundamental Component in Digital Logic Design
  • 2025 / 07 / 04

    LM324 Operational Amplifier Comprehensive Guide: Pins, Applications, Packaging, and Datasheet

    The LM324 is a low-cost integrated circuit featuring four independent operational amplifiers (op-amps), renowned for its wide voltage adaptability, low power consumption, and high reliability in industrial and consumer electronics. With a single-supply voltage range of 3V to 32V (or dual-supply rang...

    LM324 Operational Amplifier Comprehensive Guide: Pins, Applications, Packaging, and Datasheet
  • 2025 / 07 / 02

    A Comprehensive Guide to Replacing Opto-Couplers with Digital Isolators: From Principles to Practice

    In the ever-evolving landscape of electronic design, the transition from opto-couplers to digital isolators marks a pivotal shift in isolation technology. For decades, opto-couplers have been the cornerstone of electrical isolation in industrial control, medical devices, and power systems, relying o...

    A Comprehensive Guide to Replacing Opto-Couplers with Digital Isolators: From Principles to Practice
  • 2025 / 06 / 30

    Multivariate Application Analysis of Power Amplifiers in Sensor Testing

    In the field of modern sensor testing, power amplifiers (PAs) serve as core components and play an indispensable role. From amplifying weak signals to simulating complex physical environments, power amplifiers provide solid guarantees for the precise testing of sensor performance through their uniqu...

    Multivariate Application Analysis of Power Amplifiers in Sensor Testing
  • 2025 / 06 / 28

    ESP32 vs STM32: Which Microcontroller Suits You Better?

    In the field of embedded development, both ESP32 and STM32 are highly favored microcontrollers, each with unique features and advantages. When facing project development, how do you choose between them? This requires comprehensive consideration of multiple factors. The following detailed comparison ...

    ESP32 vs STM32: Which Microcontroller Suits You Better?
  • 2025 / 06 / 26

    Key Strategies to Enhance Buck Power Supply Efficiency

    Improving the efficiency of Buck (step-down) switching power supplies requires a multi-dimensional approach targeting energy loss sources, including component selection, topology optimization, control strategies, and thermal management. Below are core strategies and engineering practices:...

    Key Strategies to Enhance Buck Power Supply Efficiency
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse